Universal Laser Systems (ULS)

What is a flying optics laser?

A flying optics laser allows a beam to be guided to the material by an x- and y-axis. This method of material modification provides numerous advantages to customers such as the ability to quickly change designs, produce products without the need for tooling, and improve quality of finished parts.

What is Laser Engraving?

Subtractive Manufacturing method, that uses a laser beam to change the surface of an object. This process is mostly used to create images on the material, that may be seen at eye level. To do so, the laser creates high heat that will vaporize the matter, thus exposing cavities that will form the final image.

raster laser engraving

What is Laser Cutting?

Non-contact process which utilizes a laser to cut materials, resulting in high quality, dimensionally accurate cuts. The material melts, burns, vaporizes, or is blown away by a jet of gas, leaving an edge with a high-quality surface finish.
vector laser cutting

Raster Performance Comparison

​The Performance Difference

Universal Laser Systems technology innovations have brought flexibility and return on investment to laser material processing customers for nearly 30 years. View the videos below to gain a better understanding of these innovations and how they can improve your productivity and quality. Be sure to return as others are added in the future.

​Vector Performance Comparison

​The Performance Difference

Universal Laser Systems technology innovations have brought flexibility and return on investment to laser material processing customers for nearly 30 years. View the videos below to gain a better understanding of these innovations and how they can improve your productivity and quality. Be sure to return as others are added in the future.

Universal Laser Systems Innovations

The mission of Universal Laser Systems Inc. (ULS) is to advance the development and deployment of material processing tools that leverage the unique characteristics of laser technology for the modification and transformation of a vast number of materials into parts and products.

Our distinct advantage, which separates us from the competition, stems from our design philosophy which focuses on developing innovative technologies and modular components to deliver the best customized laser material processing systems for the broadest range of materials at a reasonable cost. Instead of integrating components available on the open market, ULS invests in extensive, forward-looking research and development programs to provide an ecosystem of products that afford our customers a unique solution.

Desktop VLS 2.30

Desktop Laser Overview

The VLS2.30 Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16″ x 12″ x 4″ or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO2 30 watt laser source.

Desktop VLS 2.30DT

Desktop Laser Overview

The VLS2.30 Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16″ x 12″ x 4″ or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO2 30 watt laser source.

Desktop VLS 3.50

Desktop Laser Overview

The VLS3.50 Desktop is a compact and economical entry level platform that offers a material processing envelope of 24″ x 12″ x 4″ or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.50 can be equipped with one of five 10.6µm CO2 laser sources ranging in power from 10 to 50 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Desktop VLS 3.60DT

Desktop Laser Overview

The VLS3.50 Desktop is a compact and economical entry level platform that offers a material processing envelope of 24″ x 12″ x 4″ or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.50 can be equipped with one of five 10.6µm CO2 laser sources ranging in power from 10 to 50 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform VLS 3.60

Platform Laser Overview

The VLS3.60 is a free-standing platform with a materials processing envelope of 24″ x 12″ x 9″ or 2,592 in³ (610 x 305 x 229 mm or 42,475 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform VLS 3.75

Platform Laser Overview

The VLS3.75 is a free-standing platform with a materials processing envelope of 24″ x 12″ x 9″ or 2,592 in³ (610 x 305 x 229 mm or 42,475 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform VLS 4.60

Platform Laser Overview

The VLS4.60 is a free-standing platform with a materials processing envelope of 24″ x 18″ x 9″or 3,888 in³ (610 x 457 x 229 mm or 63,713 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform VLS 4.75

Platform Laser Overview

The VLS4.60 is a free-standing platform with a materials processing envelope of 24″ x 18″ x 9″or 3,888 in³ (610 x 457 x 229 mm or 63,713 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform VLS 6.60

Platform Laser Overview

The VLS6.60 is a free-standing platform with a material processing envelope of 32″ x 18″ x 9″ or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform VLS 6.75

Platform Laser Overview

The VLS6.60 is a free-standing platform with a material processing envelope of 32″ x 18″ x 9″ or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Platform PLS 6.75

Platform Laser Overview

The PLS6.75 is a free-standing platform with a material processing envelope of 32″ x 18″ x 9″ or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50, or 75 watts).

Platform PLS 6.150D

Platform Laser Overview

The PLS6.150D is a free-standing platform with a materials processing envelope of 32″ x 18″ x 9″ or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³) that supports dual lasers. As a dual laser platform, the PLS6.150 can support up to two 10.6µm CO2 lasers with a power range of 10 watts to 150 watts. Additionally, it can support a single 9.3µm CO2 of 30, 50 or 75 watts. (if a 9.3µm CO2 laser is installed, only one 10.6µm CO2 of up to 75 watts may be installed at the same time.)

Platform PLS Multi-Wave (MW)

Platform Laser Overview

The PLS6MW (Multi-Wavelength) is a free-standing platform uses multiple laser wavelengths to process the broadest possible spectrum of materials and supports either CO2 or fiber lasers. The PLS6MW has a materials processing envelope of 32″ x 18″ x 9″ or 5,184 in³ (813 x 457 x 229 mm or 84,950 cm³). With Universal’s Rapid Reconfiguration technology, any one of the following lasers can be used: one 10.6µm CO2 laser (available from 10 to 75 watts); one 9.3µm CO2 laser (available in 30, 50 or 75 watts); one 1.06µm fiber laser (available in 40 and 50 watts).

Platform ILS 9.75

Platform Laser Overview

The ILS9.75 is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50, or 75 watts).

Platform ILS 9.150D

Platform Laser Overview

The ILS9.150D is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The dual laser platform supports a power range of 10 to 150 watts (up to 75 watts with one 10.6µm CO2 laser; up to 150 watts with a second 10.6µm CO2 laser).

The ILS9.150D also supports a single 9.3µm laser at 30, 50 or 75 watts (If a 9.3µm CO2 laser is installed, the maximum 10.6µm laser is 75 watts).

Platform ILS 12.75

Platform Laser Overview

The ILS12.75 is a free-standing platform with a materials processing envelope of 48″ x 24″ x 12″ or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50 or 75 watts).

Platform ILS 12.150D

Platform Laser Overview

The ILS12.150D is a free-standing platform with a materials processing envelope of 48″ x 24″ x 12″ or 13,824 in³ (1219mm x 610mm x 305mm or 226,795 cm³). The dual laser platform supports a power range of 10 to 150 watts (up to 75 watts with one 10.6µm CO2 laser; up to 150 watts with a second 10.6µm CO2 laser). The ILS12.150D also supports a single 9.3µm laser at 30, 50 or 75 watts (If a 9.3µm CO2 laser is installed, the maximum 10.6µm laser is 75 watts).

Ultra R5000

Platform Laser Overview

The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.

The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610), with support for materials with a thickness up to 12 in (305 mm).

Ultra X6000

Platform Laser Overview

The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.

The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610), with support for materials with a thickness up to 12 in (305 mm).

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How DLMP® Technology Works

How DLMP® Technology Works

DLMP® Technology Digital Laser Material Processing technology enables users to laser cut, engrave, and mark on almost any material. The capabilities of the unique ULS DLMP® systems expand the potential for applications across organizations and in multiple departments...

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